Wafer dicing and grinding is currently the only technology for full planarization, and the composition of the wastewater generated by the process is complex. Through the Neosorb solution, the existing PAC/PAM is replaced with a one-dose powder flocculant, which aggregates the fine particles suspended in the water into large particles and effectively settles. The turbidity of the clarified liquid in the chemical sedimentation tank has dropped from 26.3NTU to 5.9NTU, a significant drop Release the suspended solids in the flowing water.

*The picture shows a chemical sedimentation tank for wafer grinding wastewater in a certain factory. The fine suspended matter no longer appears after proper treatment.