"Want to enhance the thermal conductivity of your product? Can't achieve a high filling rate with alumina oxide? Boron nitride and aluminum nitride too expensive? Are these the challenges you're facing? Perhaps you'd like to hear our suggestions!
Kelly Chemical offers solutions for thermal conductive powders, along with assistance in addressing dispersion issues. Feel free to contact us for product inquiries.
Thermal conductive materials mainly utilize polymer high molecular materials. Polymer composite thermal conductive materials include thermal conductive adhesives, thermal pads, thermal silicone grease, and other products. Since the thermal conductivity coefficient of polymer high molecules is relatively low (for example, for resins, the thermal conductivity coefficient is only 0.2 W/(m·K)), it's necessary to add fillers with higher thermal conductivity to form heat conduction paths within the polymer, thus achieving conduction. It can be said that thermal conductive fillers are the key to determining the thermal conductivity performance of a product.
Alumina oxide possesses advantages such as thermal conductivity and insulation, making it suitable as a thermal conductive filler for preparing thermal conductive insulation adhesives, potting compounds, silicone pads, and other thermal interface materials. Although the thermal conductivity of alumina oxide is not exceptionally high compared to other fillers, it can generally meet the applications of thermal interface materials, thermal engineering plastics, and aluminum-based copper foil substrates. Moreover, alumina oxide is economically priced and widely available, making it an economical filler for high thermal conductivity insulation polymers.
Thermal alumina oxide is a white crystalline powder formed under high-temperature conditions, with numerous crystalline powders. Alumina oxide used for thermal conduction includes spherical alumina oxide, pseudo-spherical alumina oxide, composite alumina oxide, etc. Thermal alumina oxide must have characteristics such as narrow particle size distribution, good stability of particle size, high thermal conductivity coefficient K value, and high filling rate after coupling modification. Generally, if the average particle size of thermal alumina oxide can be controlled within a reasonable range, the thermal conductivity coefficient can reach between 3-10 W/(m*K) depending on the filling amount.
Comparison of Several Thermal Conductive Fillers~
|
Filler Type
|
Thermal Conductivity W/(m*K) |
Advantages and Disadvantages |
| Aluminum Nitride (AlN) | 80-320 | Expensive; prone to hydrolysis when moistened, resulting in the production of aluminum hydroxide that may block the thermal conduction path, reducing the thermal conductivity effect of the product as expected. Moreover, using aluminum nitride alone in large quantities will cause a sharp increase in system viscosity. |
|
Boron Nitride (BN) |
60-125 | Expensive; a sharp increase in system viscosity when used in large quantities; making it spherical may be one solution. |
| Alumina Oxide (Al2O3) | 38 | Moderate price; spherical or pseudo-spherical alumina oxide allows for a significant increase in filling amount to meet high thermal conductivity requirements. |
| Silicon Dioxide (SiO2) | 5-15 | Relatively low thermal conductivity, but can be mixed with other types of powders to increase filling rate. |
#Spherical Alumina #High Thermal Conductivity Coefficient #High Filling #Thermal Silicone Grease #5G #Silicone Pad #CCL
