High-filling, low-cost, low-viscosity thermal solution!!~

 

Kelly Chemical offers various high-spec thermal fillers, effectively enhancing the added value of products.

 

With the booming development of 5G and electric vehicles, electronic components are moving towards high performance and high density. At the same time, the substantial heat generated during product operation poses significant challenges to the thermal management of electronic components. To ensure the continuous and stable operation of electronic components, thermal insulation materials with high heat dissipation performance have become an indispensable key in electronic product thermal design.

 

As the thermal conductivity coefficient of polymer materials is inherently low, the thermal conductivity coefficient of composite materials is mainly controlled by fillers. How thermal fillers provide high thermal conductivity is our focus, mainly through four means, including: filler selection, matching of fillers with different particle sizes, improving the thermal conductivity of fillers themselves, and surface modification of fillers. Next, we will introduce them one by one.

 

 

1,Selection of Powders

 

Commonly used thermal conductive materials include metals, ceramics, and carbon-based fillers. Due to insulation considerations, metals cannot be used; carbon-based materials are prone to dispersion problems in the matrix during application; ceramic fillers have excellent comprehensive performance. Among them, spherical alumina is considered a cost-effective thermal insulation material in the industry due to its high thermal conductivity, low filling viscosity, and moderate price.(Extended Reading:What are the advantages of spherical Alumina(Al2O3) in heat dissipation applications? Let you know it once!)

 

Increasing the thermal conductivity rate may seem straightforward, but achieving better thermal conductivity through reasonable filler matching is not easy and requires the use of the following three methods.

 

2,Enhancing the Thermal Conductivity of Fillers Themselves

 

The structure determines the performance. To improve the thermal conductivity of alumina itself, alumina fillers must have a high content of the α-phase. Gonglong also provides high α-phase spherical alumina powders for selection.

 

3,Mixing Fillers of Different Particle Sizes

 

The filling effect of different particle size fillers must be better than that of single particle size filling. Under different particle size ratios, the viscosity and thermal conductivity coefficient of composite materials vary with the relative content of the two fillers. Using particles of different sizes for mixed filling can increase the filling amount, with small particles filling the gaps formed by large particles, and the size-different particles are densely packed to form a better thermal conduction path.

 

4,Surface Modification of Fillers

 

Due to the strong polarity of alumina surfaces, their compatibility with organic resin matrices is poor. How to reduce the interfacial compatibility between alumina powders and polymer matrices has become an important issue in the field of alumina filling materials. Surface modification of alumina has improved its compatibility with the matrix.

 

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