Nano-spherical silica has become increasingly popular in the electronics field due to its remarkable properties, even becoming a key material for the iPhone 15!!
Recent reports from foreign media indicate that Apple is using 0.5-micron diameter spherical silica in the semiconductor devices of the newly released iPhone 15, considering it a crucial material.
The high heat resistance of spherical silica makes it indispensable for manufacturing high-performance semiconductors. It is mixed into plastics/adhesives used to cover and protect chips to prevent thermal expansion. However, there are significant differences between SiO2 made using different processes! Advanced applications require low specific surface area, high purity, and high filling rate spherical silica. Most of the time, different particle sizes of SiO2 are also used to improve filling rate and flowability. Surface treatment is also a major technological barrier, preventing aggregation and increasing compatibility with resins. Compared to traditional methods such as vapor-phase deposition and physical grinding, SiO2 produced has much lower filling rates.
(Extended Reading:Spherical silica(SiO2) is the best choice for semiconductor packaging and CCL fillers!! )
Advantages of spherical silica-
Silicon dioxide has good dielectric properties, a lower coefficient of thermal expansion, and other comprehensive properties, making it widely used in epoxy encapsulants, electronic adhesives, and copper foil substrates. High filling of silica can reduce costs, increase thermal conductivity, reduce coefficient of thermal expansion, and increase strength. However, as the filling amount increases, system viscosity sharply increases, material flowability and permeability decrease, silica dispersion in resin becomes difficult, and aggregation problems are prone to occur. Therefore, choosing a good silica material is crucial for formulation development。
Common applications of spherical silica:
Electronic semiconductors:
- Liquid sealing materials
- Chip connection materials
- Circuit board materials
- Corrosion-resistant material fillers.
- Anisotropic conductive adhesive ACF/ABF carrier board resin filler
Optical materials:
- Transparent adhesives materials and substrates.
- Resin fillers and additives
- Powder flow aids
- Grinding particles
- Paints, and scratch-resistant coatings.
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