Hy-Cl below 200ppm, viscosity (cps at 25oC) below 3000. Used in semiconductors, PCBs, conductive adhesives, LEDs.
Hy-Cl is less than 50ppm, viscosity (cps at 25oC) is less than 5000. Used in semiconductors, PCBs, conductive adhesives, LEDs.
Hy-Cl is less than 50ppm, viscosity (cps at 25oC) is less than 3000. Used in semiconductors, PCBs, conductive adhesives, LEDs.
Hy-Cl is less than 350ppm, high Tg, low CTE. Suitable for EMC, laminates, etc. that require good electrical characteristics.
BPA is less than 1ppm, no endocrine disruption. Meets the requirements of food packaging coatings 21 CFR 175.300.
Viscosity (cps at 25 oC) below 5000. Excellent flexibility and adhesive strength.
Excellent adhesive strength and high heat and chemical resistance. Suitable for basic raw materials for laminates and composite materials.
Excellent adhesion and impact toughness. Its excellent mechanical properties are suitable for the application of special composite materials.
Viscosity 2,500-4,000 cps at 25oC. Suitable for outdoor use and other applications requiring good weather resistance.
It does not debond at high temperatures, the refractive index is 1.62, and Hy-Cl is less than 350ppm. Suitable for laminates, packaging grinding, and LED packaging.
