No matter what kind of construction technology, it must be sealed with resin material in order to avoid the influence of dust, external force or moisture, which will damage the IC chip, connecting wire or Solder Bump. In advanced packaging technology, the requirements for supporting high-frequency and high-speed performance are increasing day by day. Therefore, the future research and development direction of related packaging materials needs to move towards lower Df values. Molding materials are no exception. International manufacturers are developing materials with lower Df values. formula. On the other hand, since the molding material may not match the CTE value between the IC substrate and the IC substrate after cooling down in the manufacturing process, warpage will occur. Therefore, the future development of molding materials will focus on The development direction of Low CTE, Low Modulus, high fluidity and low dielectric properties.